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|Application Notes: 55, 59, 60, 61, 62|
The MicroCleave™ technique is a relatively simple and inexpensive method of producing superior cross
sectional TEM specimens. For speed of preparation, it is unsurpassed. One limitation is that the technique does require the substrate material
to cleave or fracture. For this reason, it has been applied almost exclusively to semiconductor materials. Recently, the technique has been
extended to other substrates such as glass, silicon carbide, quartz, sapphire, and other hard materials. It is particularly well suited for rapidly
examining coatings and thin films very soon after they are deposited.