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Application Notes - Complete Listing
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Number Title - Click on Title to Print Instruments Used
1 Characterizing Lip Effect on Thin Metal Foils 310
2 Evaluating the Precision of Abrasive Slurry Disc Cutting Techniques on GaAs 360
3 Characterization of Model 38001 380, 38001
4 Cutting 8 mm Discs from Hard Disc Drives 380
5 Cutting Thin Si Wafers 380
6 Lapping and Polishing ZnO Single Crystals to Optical Smoothness 920, 151
8 Preparation of Surface Mount Packages Directly on PC Boards for Backside Emission Analysis 575
11 Preparation of Hard Disk Drive Magnetic Recording Media for XTEM Analysis 590
12 Cross Sectioning Small Hole Arrays 590
13 Optimizing Cutting Conditions for Polymeric Materials 650, 660
14 Characterizing the Model 660 Low Speed Diamond Saw 660
15 Precision Cutting BGA Packages for Ball Bond Integrity Testing 850
16 Cutting Highly Different Hardness Materials for Adhesion Analysis 850
17 Cutting Glass Optical Ferrules using Two Cutting Methods 850, 650
18 Cutting DRAM IC's to Specific Area Prior to FIB Preparation 850
19 Low Damage Cross Sectioning of Flip Chip Packages 850
20 Precision Cutting of Packaged IC Devices from Printed Circuit Boards 850
21 Characterizing the Model 850 Wire Saw 850
22 Polishing Protocol for Glass Cover Slides 920, 92002
23 Lapping and Polishing Glass to Optical Smoothness 920, 155, 92002
24 Preparing Planar Specimens of Entire PC Board Components 920, 92003
25 Lapping and Polishing SiC Wafers 920, 92002, 155
26 Optical Polishing Polystyrene Discs to Specific Dimensions 920, 155, 92002
27 Using the Model 25010 Oriented Crystal Polisher on Model 920 920, 92002, 25010
31 Evaluation of Solvent Free Removal of Waxes Wax, WaxCut
34 Preparation of GaN / Sapphire for TEM using Tripod Polishing 590, 920, IV3
35 Ion Milling Parameters for Various Materials Systems IV3
36 Plasma Cleaning of Various Specimens for use in TEM PC 150
37 Cutting Rates of Materials on Various Cutting Instruments 650, 660, 850, 860
38 Characterizing Low and High Concentration Diamond Wheels for Cutting Materials 650
39 Comparing Cutting Times of Selected Diamond Wheel Types 650
40 Lapping and Polishing LiNbO3 Crystals at Specific Angles 920, 163, 92002
41 Cutting Fiber Optic Connectors Using Model 850 850
43 Cutting CdTe Detector Discs to Specific Diameter 360
44 Cutting AlC Composite for Shaping 850
46 Lapping and Polishing Si Die and Wafers 920, 155
47 Lapping and Polishing Si Die to Optical Polish Quality 920, 150
48 Preparation of Otoliths for Laser Chemical Analysis 920, 195
49 Cutting Ti Nb Alloy to Specific Thickness 650
51 Cutting Encapsulated Cu Sheet using Model 850 Wire Saw 850
52 Cutting Various Composite Materials for Microscopic Investigation 660
53 Sample Preparation of Optical Crystals: Cutting and Polishing Methods 850, 920, 155E
54 Lapping and Polishing Basics 920
55 GaN / Sapphire Prepared by the MicroCleave Technique 520
56 Lapping and Polishing GaN Fiber Towers for VCSEL Applications 920, 150
57 Parallel Laping of Devices for Deprocessing 920, 155
58 Evaluation of the Polishing Quality for Edge Polished Silicon 920, 155E
59 EELS of PLD DLC 520
60 Prethinning for FIB TEM Sample Preparation using the Small Angle Cleavage Technique 520
61 SACT Preparation of MBE Grown QWIP on GaAs 520
62 The Small Angle Cleavage Technique: An Update 520
63 Plasma Trimming Applications PC 2000
65 Monitoring and Measuring Plate Flatness 920
66 Selecting a Diamond Wheel 650
68 Improving High Resolution Images using Low Energy Ion Milling TL-GM1
70 Cutting Steel/Cr Alloy using Various Diamond Wheels 650
71 Improving Surface Quality of Petrographic Sections 920, 155
72 Comparing Wax Layer Thickness After Mounting Consumables
74 Maintaining Plate Flatness Prior to Lapping and Polishing 920
76 Applications of the GentleMillT to FIB Prepared TEM Specimens TL-GM1
77 A Method for Pre-FIB Specimen Preparation 650, 920, 590
79 Processing YVO4 and Electro-Optic Crystals for Small Scale Fabrication 920, 147D, 850
83 Lapping and Polishing II-VI Semiconductors 920,
84 A Method for PVC Specimen Preparation 920, 150
85 Producing Smoothly Etched Surfaces using RIE RIE2000
86 Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes 920 / 155
87 Basic Arrangement of Model 910 and 920 for Processing Cross Sections 920 / 910 / 590 / 595
89 Kerf Loss Comparisons 850 / 650
91 Ion Beam Sputtering: Practical Applications to Electron Microscopy IBS/e
92 Evaluating Surface Roughness of Ion Beam Sputtered Iridium Using a Large Area Stage IBS/e
93 Proper Use of Wire Blades for the Model 850 850
94 Improved Sample Mounting for the TL-GM1 GentleMill TL-GM1
96 A Simple and Repeatable Zeroing Process for the Model D 500i Dimpler D500i
97 Accessories for the Model 920 Lapping and Polishing Machine 920
98 Setting up and Using Digital Controlled Lapping and Polishing Fixtures 920, 155D
106 Cu Composite Plate Conditioning for Flatness 920, LP920C
107 Model 93031 Flattness Monitoring Kit 920, Lapping
108 SBT Statolith preparation 150L, 180
109 KA160 7mm Catalyst Support 920, Acrylimet
110 Cross Sectional Prep of CEO2 films on NiW 865, 920, 150L, IBSe
111 Cross sectional Prep of GaAs devices 590, 910, consumable
112 Quartz tips cut with 850 wire saw 850
113 PVC plastic sample preparation 650, 920, Acrylimet
114 Precision Dimpling of MgF2 for UV properties D500i
115 SBT Sardine Otolith Preparation 920, 150L, 590, Rail Polisher
116 Precision sectioning of LiF doped crystals 850
117 Chemical Thinning Silicon with Model 550 550
120 Precisely Locating the Center of a Sample Punched with the Model 310.pdf 310
121 What is the Thickest Sample That Can Be Punched with Model 310.pdf 310
123 Kauf Man Ion Source IBS/e, KDC-10 IBS/e
125 Ion Shadow Digging IBS/e, KDC-10 IBS/e
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